发明名称 Light-emitting device and method for manufacturing the same
摘要 There is provided a light-emitting device comprising a light-emitting element. The light-emitting device of the present invention comprises an electrode part for the light-emitting element; a reflective layer provided on the electrode part; and the light-emitting element provided on the reflective layer such that the light-emitting element is in contact with at least a part of the reflective layer, wherein the light-emitting element and the electrode part are in an electrical connection with each other by mutual surface contact via the at least a part of the reflective layer, wherein the electrode part serves as a supporting layer for supporting the light-emitting element, and wherein the electrode part extends toward the outside of the light-emitting element and beyond the light-emitting element.
申请公布号 US9627583(B2) 申请公布日期 2017.04.18
申请号 US201314377965 申请日期 2013.01.28
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Sawada Susumu;Nakatani Seiichi;Kawakita Koji;Yamashita Yoshihisa
分类号 H01L33/48;H01L33/62;H01L33/60;H01L33/38;H01L23/00;H01L33/50;H01L33/64 主分类号 H01L33/48
代理机构 Wenderoth, Lind & Ponack, L.L.P. 代理人 Wenderoth, Lind & Ponack, L.L.P.
主权项 1. A light-emitting device comprising: a light-emitting diode (LED) chip; an electrode part for the LED chip; and a reflective layer provided on the electrode part, wherein the reflective layer and the electrode part have a bended form such that a central portion of the reflective layer and a central portion of the electrode part are raised, wherein the LED chip is provided on the reflective layer such that the LED chip is in contact with the central portion of the reflective layer, wherein the LED chip and the electrode part are in an electrical connection with each other by mutual surface contact via the central portion of the reflective layer, wherein the electrode part is thicker than the LED chip and has a thickness such that the electrode part serves as a supporting layer for supporting the LED chip, wherein the electrode part extends, in a lateral direction, toward an outside of the LED chip and beyond the LED chip, and wherein the electrode part is provided as a wet plating layer, and the reflective layer is provided as a dry plating layer.
地址 Osaka JP