| 发明名称 |
Lead frame with slots and a method for molding integrated circuit packages. |
| 摘要 |
<p>A lead frame (10) is connected to an integrated circuit (32) by adhesives. The lead frame (10) includes a mold gate (40) to provide for constant flow of resin (72) into the mold cavity (66) during encapsulation of the integrated circuit (32). The lead frame (10) also has an air vent (50) to direct air and any excess resin (74) from the mold cavity (66) to a dummy cavity (70). <IMAGE></p> |
| 申请公布号 |
EP0589569(A1) |
申请公布日期 |
1994.03.30 |
| 申请号 |
EP19930306743 |
申请日期 |
1993.08.25 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CHAN, MIN Y. |
| 分类号 |
H01L21/56;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L21/56;H01L21/00 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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