Method of connecting circuit boards

摘要

The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C-H bonding dissociation energy of a value equal to or lower than 950 KJ/mol. When metal pieces between which the metal connecting composition is applied is heated, the hydrocarbon compound is dehydrogenated to form radical, and the radical reduces oxide film on the metal surface to be connected.