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发明名称
DRAM混载半导体装置
摘要
为提供抑制DRAM之感测放大器电晶体对间之特性差、且谋求感测放大器之高感度化之半导体装置。构成DRAM之CMOS感测放大器之N型感测放大器电晶体的闸极电极对、及P型感测放大器电晶体的闸极电极对,系分别沿与位元线同一方向平行配置于1个主动区域内;邻接之N型感测放大器电晶体对及邻接之P型感测放大器电晶体对,系被STI绝缘分离。
申请公布号
TW200402871
申请公布日期
2004.02.16
申请号
TW092119472
申请日期
2003.07.17
申请人
松下电器产业股份有限公司
发明人
中林隆
分类号
H01L27/04
主分类号
H01L27/04
代理机构
代理人
林镒珠
主权项
地址
日本
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