发明名称 |
Wafer having alignment marks extending from a first to a second surface of the wafer |
摘要 |
A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. The back-side alignment mark extends from the front-side surface to the back-side surface of the wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.
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申请公布号 |
US6943429(B1) |
申请公布日期 |
2005.09.13 |
申请号 |
US20010803084 |
申请日期 |
2001.03.08 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
GLENN THOMAS P.;HOLLAWAY ROY DALE;WEBSTER STEVEN |
分类号 |
B23K26/00;H01L23/12;H01L23/544;H01L27/01;H01L27/04;(IPC1-7):H01L27/01 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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