| 发明名称 | Optical element module | ||
| 摘要 | An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion. | ||
| 申请公布号 | US9466942(B2) | 申请公布日期 | 2016.10.11 |
| 申请号 | US201414564270 | 申请日期 | 2014.12.09 |
| 申请人 | FURUKAWA ELECTRIC CO., LTD. | 发明人 | Matsuyama Tetsuya;Ariga Maiko;Sugaya Toshio;Kimura Toshio |
| 分类号 | H01S3/04;H01S5/024;H01S5/12;H01S5/022;H01S5/0683;H01S5/0687;H01S5/00;H01S5/026 | 主分类号 | H01S3/04 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. An optical element module comprising: a casing having a bottom plate; a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion; a support member mounted on the temperature-adjusting unit in the casing; and a semiconductor laser element being mounted on the support member and outputting a laser light to a front side, wherein the upper layer portion of the temperature-adjusting unit projects at a rear side of the semiconductor laser element relative to the lower layer portion. | ||
| 地址 | Tokyo JP | ||