Method for coupling optical fibre to optical chip

摘要

The method involves using a waveguide device provided on the optical chip. The waveguide device has waveguide path (12) embedded in one or more layers, which are applied to a substrate, and which extend up to the edge of the chip, to abutting the optical fibre core (10). Heat is applied to the junction point between the waveguide path and the optical fibre core, to bond the material of the waveguide path and the optical fibre (6) together. The waveguide path may project from the edge of the chip for improved heat dissipation during bonding.