| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently removing smears residual in a via hole formed by ultraviolet laser processing. SOLUTION: The smear removing method comprises (a) a process of applying an ultraviolet laser beam to the insulating resin layer of a workpiece having an insulating resin layer coating a metal-made inner wiring layer for the formation of a via hole in the insulating resin layer, and (b) a process of removing smears residual on the via hole bottom floor by exposure to rare gas plasma. COPYRIGHT: (C)2004,JPO |
