CASE, ELECTRONIC APPLIANCE, AND COMPOSITE MOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a case which can reduce manufacturing costs and can increase the strength of adhesion of a metal plate to an adhesive and a resin, an electronic appliance, and a composite molding method. SOLUTION: This case is equipped with a case body 3 which is composed of aluminum or an aluminum alloy, an alumite layer 4 which is formed in the case body 3, and a resin layer 6 which is formed on the alumite layer 4 via an adhesive layer 5. COPYRIGHT: (C)2006,JPO&NCIPI