发明名称 PHOTOANNEALING METHOD FOR SEMICONDUCTOR LAYER
摘要 PURPOSE:To make possible to crystallize a semiconductor layer keeping the state of the entire layer defectless by applying photoannealing treatment two times or more in the thickness direction of the semiconductor layer. CONSTITUTION:On the surface of a sapphire substrate 1, an epitaxial silicon layer 2 is formed. In such construction of an SOS, many crystal defects exist on the sapphire silicon boundary while less crystal defects exist on the silicon surface, therefore an amorphous layer 3 is formed by implanting ions of, for example, Ar to the boundary, and by irradiating laser beams to the layer to anneal it, a defectless monocrystalline layer 4 is formed. Next, Ar ions are implanted to the surface of the silicon layer, and by annealing with laser beams, the surface is made defectless and converted into a defectless monocrystalline layer 6. By so doing, the entire silicon layer can be made completely defectless.
申请公布号 JPS5633821(A) 申请公布日期 1981.04.04
申请号 JP19790109128 申请日期 1979.08.29
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 IWAMATSU SEIICHI
分类号 H01L21/20;H01L21/268;H01L21/86 主分类号 H01L21/20
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