| 摘要 |
PURPOSE:A casting composition that contains oligomers bearing radically polymerizable double bonds, monomers and a photo-polymerization initiator, thus being suitable for use in light emitting diode sealing, because it has shortened curing time and causes no corrosion of the lead wires. CONSTITUTION:The objective composition contains (A) oligomers bearing radically polymerizable double bonds such as epoxy resin, urethane resin (meth)acrylate, unsaturated polyester, preferably they are clear, (B) monomers such as methyl methacrylate, ethylene glycol di(meth)acrylate, and (C) a photo-polymerization initiator, preferably hydroxycyclohexyl phenyl ketone, preferably in an amount of 0.5-5wt%.
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