发明名称 IC PACKAGE PRESSING DEVICE IN SOLDERING DEVICE
摘要 PURPOSE:To ensure a soldering connection by providing the air rod which moves vertically inside a holder and by arranging a plate and pressing bar at the tip of the air rod as well and by equally pressing a work component with the pressing bar. CONSTITUTION:The hollow air rod 27 which moves vertically inside a holder 5 is provided, the containing cylinder 32 containing a plate 30 and pressing bar at the lower end is fitted and the upper end is connected to the 2nd motion mechanism 45 and air feeding pipe 42 as well. The IC package 23 to be con nected is placed on a printed circuit board 22 and the lead thereof is aligned respectively. Then, the lower end of the pressing bar presses equally the corner part of the package 23 respectively via the air rod 27 by descending a motion rod 46. The heating of a heating coil is performed by setting heat source units 12, 13 to the work part by descending the holder 5 with the 1st motion mecha nism 1. The dislocation of the lead is iliminated and the soldering connection is ensured.
申请公布号 JPS6289569(A) 申请公布日期 1987.04.24
申请号 JP19850228807 申请日期 1985.10.16
申请人 HAIBETSUKU:KK 发明人 HAYAKAWA HIROMI
分类号 B23K3/00;B23K1/005;B23K3/04;B23K31/02;B23K101/42;H05K3/34 主分类号 B23K3/00
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