| 摘要 |
PURPOSE:To reduce the warpage of laminated sheet available for electronic, electric and communication machineries by a method wherein specific films are arranged to the respective upper and under surfaces of a required number of long base materials to form a long laminate which is, in turn, molded under heating and pressure to be cut into a required dimension and the cut ones are heated to thermal deformation temp. or higher. CONSTITUTION:Long thermosetting polyphenylene oxide resin films 2 are supplied so as not only to arrange intermediate layers between three long glass cloths 1 but also to form outermost layers and long adhesive coated copper foils 3 are further arranged to the outermost layers so that the adhesive layers thereof are opposed thereto to form a long laminate 4 which is, in turn, molded under heating and pressure in a double belt roll apparatus 5. Thereafter, the molded laminate is cut by a cutter 6 and further heated in a heating oven 7 to obtain a laminated sheet 8. The laminated sheet after molding is cut into a required dimension and each of the cut ones is heated to thermal deformation temp. or higher not only to perform curing more perfectly but also to reduce residual strain. A molten resin is introduced into a base material under pressure and a heating and pressing time can be minimized and the residual strain in the laminated sheet can be reduced. |
