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发明名称
DIE BONDING DEVICE
摘要
申请公布号
JPH0547814(A)
申请公布日期
1993.02.26
申请号
JP19910228438
申请日期
1991.08.12
申请人
MITSUBISHI ELECTRIC CORP
发明人
KANDA MAKOTO
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
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地址
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