| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board capable of achieving high density while reducing power supply noise.SOLUTION: The wiring board is configured to include a first wiring layer, a second wiring layer, an insulating layer, and a via. First wiring to which a power supply voltage is applied is formed in the first wiring layer. Second wiring to which a voltage different from the power supply voltage is applied is formed in the second wiring layer. The insulating layer insulates the first wiring layer and the second wiring layer from each other. The via penetrates the insulating layer and has a first conductive part connected to the first wiring, a second conductive part connected to the second wiring, and a via insulating part formed by filling a space between the first conductive part and the second conductive part with an insulating material.SELECTED DRAWING: Figure 1 |
