发明名称 |
IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATING BATH COMPOSITIONS |
摘要 |
The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures. |
申请公布号 |
WO2017036816(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
WO2016EP69683 |
申请日期 |
2016.08.19 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
BRUNNER, Heiko;KOHLMANN, Lars;WITCZAK, Agnieszka;MANN, Olivier |
分类号 |
C08G71/02;C25D3/38 |
主分类号 |
C08G71/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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