Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

摘要

A stacked chip package is provided. The stacked chip package includes a first substrate having a first side and a second side opposite thereto. The first substrate includes a recess therein. The recess adjoins a side edge of the first substrate. A plurality of redistribution layers is disposed on the first substrate and extends onto the bottom of the recess. A second substrate is disposed on the first side of the first substrate. A plurality of bonding wires is correspondingly disposed on the redistribution layers in the recess, and extends onto the second substrate. A device substrate is disposed on the second side of the first substrate. A method of forming the stacked chip package is also provided.

主权项

1. A stacked chip package, comprising:
at least one first substrate having a first side and a second side opposite thereto, wherein the at least one first substrate comprises: a recess in the at least one first substrate and adjoining a side edge of the at least one first substrate; and a plurality of redistribution layers disposed on the at least one first substrate and extending onto a bottom of the recess, wherein at least two of the plurality of redistribution layers comprise an end extending into the recess, and the ends have an expanded portion; at least one second substrate disposed on the first side of the at least one first substrate; a plurality of bonding wires correspondingly disposed on the plurality of redistribution layers in the recess, and extending onto the at least one second substrate; and at least one device substrate disposed on the second side of the at least one first substrate.