| 发明名称 |
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A wiring substrate includes an insulating layer, at least one via hole formed in the insulating layer, a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole, a second wiring layer formed on the other surface of the insulating layer, and a metal-plated layer formed in the via hole and configured to connect the second wiring layer and the droop portion of the first wiring layer. One surface of the insulating layer around the via hole is formed as a convex curved surface and the droop portion of the first wiring layer is arranged on the convex curved surface. |
| 申请公布号 |
US2017110394(A1) |
申请公布日期 |
2017.04.20 |
| 申请号 |
US201615293464 |
申请日期 |
2016.10.14 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
Denda Tatsuaki |
| 分类号 |
H01L23/498;H01L23/31;H01L23/00;H01L21/48;H01L21/56 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate comprising:
an insulating layer; at least one via hole formed in the insulating layer; a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole; a second wiring layer formed on the other surface of the insulating layer; and a metal-plated layer formed in the via hole and configured to connect the second wiring layer and the droop portion of the first wiring layer, wherein one surface of the insulating layer around the via hole is formed as a convex curved surface and the droop portion of the first wiring layer is arranged on the convex curved surface. |
| 地址 |
Nagano-shi JP |
