Methods for masking and applying protective coatings to electronic assemblies

摘要

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

主权项

1. A method for coating an electronic device, comprising:
assembling at least first and second components of an electronic device to form an electronic assembly, the first component including at least one of an exterior component of the electronic device, light emission element of the electronic device, an imaging element of the electronic device, or a sensor of the electronic device; applying a mask over at least one of the light emission element, the imaging element or the sensor of the electronic assembly, the mask shielding the light emission element, the imaging element or the sensor, wherein the mask covers portions of opposite surfaces of the electronic assembly; applying a water-resistant protective coating to at least two components of the electronic assembly with the mask in place; and removing the mask from the electronic assembly, the water-resistant protective coating remaining on coated portions of the electronic assembly, uncoated portions of the electronic assembly, including the light emission element, the imaging element or the sensor, being exposed through removal of the mask.