Package for mounting electronic element, electronic device, and imaging module

摘要

There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.

主权项

1. A package for mounting an electronic element, comprising:
an insulating base having a plate-shaped base section including an upper main surface on which an electronic element is to be mounted, and a frame section disposed on the upper main surface of the plate-shaped base section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section, being electrically connected to the electrode pad; and a wiring conductor including a first through conductor which is entirely embedded within the frame section and is electrically connected to the first wall conductor, and a second through conductor which is embedded within the base section and is electrically connected to the first through conductor.