HERMETIC FILTER FEEDTHROUGH INCLUDING MLCC-TYPE CAPACITORS FOR USE WITH AN ACTIVE IMPLANTABLE MEDICAL DEVICE

摘要

A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.

主权项

1. A filter feedthrough for an active implantable medical device, the filter feedthrough comprising:
a) a hermetic feedthrough, comprising:
i) a conductive ferrule comprising a ferrule sidewall having an inner ferrule surface defining a ferrule opening, wherein the ferrule sidewall extends from a first ferrule end surface spaced from a second ferrule end surface;ii) an insulator disposed at least partially within the inner ferrule surface, wherein the insulator comprises an outer insulator surface extending to a first insulator end surface adjacent to the first ferrule end surface and an opposed second insulator end surface adjacent to the second ferrule end surface;iii) at least one via hole extending through the insulator from the first insulator end surface to the second insulator end surface; andiv) a conductive fill disposed within the at least one via hole in a hermetically sealed relationship therewith to thereby provide an electrically conductive path extending from a first fill end at or adjacent to the first insulator end surface to a second fill end at or adjacent to the second insulator end surface; andv) a first metallization contacting at least a portion of the outer surface of the insulator; and b) at least one capacitor, comprising:
i) a capacitor dielectric body;ii) at least one active electrode plate and at least one ground electrode plate supported by the capacitor dielectric body in spaced relation with each other;iii) a second metallization contacting and electrically coupled to the at least one active electrode plate at a first outer surface of the capacitor dielectric body; andiv) a third metallization contacting and electrically coupled to the at least one ground electrode plate at a second outer surface of the capacitor dielectric body; c) a first electrical connection physically contacting and electrically coupling the second metallization to the conductive fill in the at least one via hole to thereby electrically connect the at least one active electrode plate of the capacitor to the conductive fill; d) a second electrical connection physically contacting and electrically coupling the third metallization contacting the at least one ground electrode plate of the capacitor to the first metallization contacting the outer surface of the insulator; and e) an electrically conductive material that provides a hermetic seal electrically coupling the first metallization contacting the outer surface of the insulator to the ferrule to thereby electrically couple the capacitor to the ferrule.