| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device that improves manufacturing efficiency through short-time mounting and sealing, hinders occurrence of void, ensures solder wettability, and also hinders peeling.SOLUTION: An acrylic resin composition for semiconductor sealing contains: a thermosetting acrylic resin in the form of liquid at room temperature; organic peroxide, which is a radical initiator whose one-minute half-life temperature is 150 to 180°C; an epoxy resin; a curative agent for the epoxy resin, whose reaction initiating temperature is 180°C or higher; an activator; and inorganic filler. A circuit board with the acrylic resin composition supplied thereto is mounted on a stage heated to a predetermined range of temperature. A bonding head holding a semiconductor chip and heated to a predetermined range of temperature is grounded and held. Thereafter, the temperature of the bonding head is increased, in a predetermined range of time, to a temperature equal to or higher than the melting point of lead-free solder, which is equal to or higher than 210°C that is the melting point of a bump electrode of the semiconductor chip, and is held to cure the resin composition. Then, the bonding head is raised from the stage within five seconds or less from the grounding of it. |
