发明名称 Power supply module
摘要 A power supply module includes a circuit board and a heatsink plate. The circuit board has a first principal surface, a second principal surface, and side surfaces. Electronic components are mounted on the first principal surface. The heatsink plate has a plate-like body portion that faces the first principal surface, and a plurality of fixing portions that extend at an angle from the body portion to face the side surfaces. The fixing portions are configured to come into contact with the second principal surface to secure the body portion to the circuit board.
申请公布号 EP2651203(A3) 申请公布日期 2017.03.08
申请号 EP20130162051 申请日期 2013.04.03
申请人 Murata Manufacturing Co., Ltd. 发明人 Nagai, Jun;Tsubono, Masanori
分类号 H05K7/14;H02B1/56;H05K7/20 主分类号 H05K7/14
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