| 摘要 |
Embodiments of the present invention relate to the field of terminal technologies and disclose a mobile terminal, which can improve a heat dissipation effect of a chip and lower a temperature of the chip. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the mobile terminal, and a groove is provided on a second surface of the mobile terminal. The mobile terminal further includes a heat pipe, where the heat pipe is disposed in the groove, and one end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board. |
