发明名称 Graphene and metal interconnects
摘要 A graphene and metal interconnect structure and methods of making the same are disclosed. The graphene is a multiple layer graphene structure that is grown using a graphene catalyst. The graphene forms an electrical connection between two or more VIAs or components, or a combination of VIAs and components. A VIA includes a fill metal, with at least a portion of the fill metal being surrounded by a barrier metal. A component may be a routing track, a clock signal source, a power source, an electromagnetic signal source, a ground terminal, a transistor, a macrocell, or a combination thereof. The graphene is grown, using a graphene catalyst, from both solid and liquid carbon sources using chemical vapor deposition (CVD) at a temperature between 300° C.-400° C. The graphene catalyst can be an elemental form of, or alloy including, nickel, palladium, ruthenium, iridium or copper.
申请公布号 GB2523948(B) 申请公布日期 2017.02.22
申请号 GB20150011991 申请日期 2013.12.09
申请人 International Business Machines Corporation 发明人 Junjing Bao;Griselda Bonilla;Ronald G Filippi;Naftali E Lustig;Andrew H Simon;Samuel S Choi
分类号 H01L23/532;H01L21/768 主分类号 H01L23/532
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