METHOD FOR PRODUCING A COMPONENT, AND A COMPONENT

摘要

The invention relates to a method for producing a component, wherein a composite having a semiconductor layer stack and connection layers is provided. Vias are formed on the connection layers before a molded body material is applied onto the composite in order to form a molded body. The vias extend through the molded body and are enclosed by the molded body over the entire circumference such that the molded body and the vias form a permanently connected support which mechanically supports the component to be produced. The invention additionally relates to a component which is produced using such a method in particular, wherein on a plane connecting the first connecting layer to the first via, the first connection layer has a lateral cross-section which is equal to or greater than that of the first via, and both the first connection layer as well as the first via are enclosed by the molded body in lateral directions over the entire circumference.