| 发明名称 | Printed circuit board and method of manufacturing the same | ||
| 摘要 | A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via. | ||
| 申请公布号 | US9554466(B2) | 申请公布日期 | 2017.01.24 |
| 申请号 | US201514966518 | 申请日期 | 2015.12.11 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Kang Myung-Sam;Ko Young-Gwan;Kim Sang-Hoon;Bong Kang-Wook;Jung Hye-Won;Ji Yong-Wan |
| 分类号 | H05K1/11;H05K3/42;H05K1/03;H05K3/00 | 主分类号 | H05K1/11 |
| 代理机构 | NSIP Law | 代理人 | NSIP Law |
| 主权项 | 1. A printed circuit board comprising: an insulating layer comprising a first resin layer and a second resin layer; circuit layers disposed on upper and lower surfaces of the insulating layer; and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, wherein the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via. | ||
| 地址 | Suwon-si KR | ||