发明名称 HORIZONTAL GATE ALL AROUND DEVICE ISOLATION
摘要 Embodiments described herein generally relate to methods and apparatus for horizontal gate all around (hGAA) isolation. A superlattice structure comprising different materials arranged in an alternatingly stacked formation may be formed on a substrate. The different materials may be silicon containing materials and one or more III/V materials. In one embodiment, at least one of the layers of the superlattice structure may be oxidized to form a buried oxide layer adjacent the substrate.
申请公布号 US2017018624(A1) 申请公布日期 2017.01.19
申请号 US201615279257 申请日期 2016.09.28
申请人 Applied Materials, Inc. 发明人 SUN Shiyu;YOSHIDA Naomi;GUARINI Theresa Kramer;JUN Sung Won;COLOMBEAU Benjamin;CHUDZIK Michael
分类号 H01L29/423;H01L21/306;H01L21/762;H01L21/02 主分类号 H01L29/423
代理机构 代理人
主权项 1. A method of forming a semiconductor device, comprising: forming a superlattice structure on a substrate, wherein the superlattice structure comprises: a first material layer;a second material layer; anda third material layer; etching the superlattice structure; depositing a liner on the superlattice structure; depositing an oxide material layer on the substrate; and oxidizing at least one of the first material layer, the second material layer, or the third material layer to form a buried oxide layer, wherein the liner selectively prevents oxidation of two of the material layers preferentially to the material layer which forms the buried oxide.
地址 Santa Clara CA US