发明名称 |
HORIZONTAL GATE ALL AROUND DEVICE ISOLATION |
摘要 |
Embodiments described herein generally relate to methods and apparatus for horizontal gate all around (hGAA) isolation. A superlattice structure comprising different materials arranged in an alternatingly stacked formation may be formed on a substrate. The different materials may be silicon containing materials and one or more III/V materials. In one embodiment, at least one of the layers of the superlattice structure may be oxidized to form a buried oxide layer adjacent the substrate. |
申请公布号 |
US2017018624(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201615279257 |
申请日期 |
2016.09.28 |
申请人 |
Applied Materials, Inc. |
发明人 |
SUN Shiyu;YOSHIDA Naomi;GUARINI Theresa Kramer;JUN Sung Won;COLOMBEAU Benjamin;CHUDZIK Michael |
分类号 |
H01L29/423;H01L21/306;H01L21/762;H01L21/02 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor device, comprising:
forming a superlattice structure on a substrate, wherein the superlattice structure comprises:
a first material layer;a second material layer; anda third material layer; etching the superlattice structure; depositing a liner on the superlattice structure; depositing an oxide material layer on the substrate; and oxidizing at least one of the first material layer, the second material layer, or the third material layer to form a buried oxide layer, wherein the liner selectively prevents oxidation of two of the material layers preferentially to the material layer which forms the buried oxide. |
地址 |
Santa Clara CA US |