发明名称 |
ELECTRONIC DEVICES COMPRISING A VIA AND METHODS OF FORMING SUCH ELECTRONIC DEVICES |
摘要 |
A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface. |
申请公布号 |
WO2017003789(A1) |
申请公布日期 |
2017.01.05 |
申请号 |
WO2016US38757 |
申请日期 |
2016.06.22 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
STAY, Matthew S.;DODDS, Shawn C.;GILMAN, Ann Marie;PERKUROVSKY, Mikhail L.;THEIS, Daniel J.;SMITH, Matthew R. |
分类号 |
H05K3/40;B41N1/00;G06F3/041;H05K1/02;H05K1/03;H05K1/09;H05K3/00;H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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