发明名称 ELECTRONIC DEVICES COMPRISING A VIA AND METHODS OF FORMING SUCH ELECTRONIC DEVICES
摘要 A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
申请公布号 WO2017003789(A1) 申请公布日期 2017.01.05
申请号 WO2016US38757 申请日期 2016.06.22
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 STAY, Matthew S.;DODDS, Shawn C.;GILMAN, Ann Marie;PERKUROVSKY, Mikhail L.;THEIS, Daniel J.;SMITH, Matthew R.
分类号 H05K3/40;B41N1/00;G06F3/041;H05K1/02;H05K1/03;H05K1/09;H05K3/00;H05K3/46 主分类号 H05K3/40
代理机构 代理人
主权项
地址