| 发明名称 |
Integrated heat exchanger and power delivery system for high powered electronic modules |
| 摘要 |
An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules. |
| 申请公布号 |
US9538692(B2) |
申请公布日期 |
2017.01.03 |
| 申请号 |
US201414429099 |
申请日期 |
2014.07.09 |
| 申请人 |
BAE Systems Information and Electronic Systems Integration Inc. |
发明人 |
Sliech Kevin W.;Hedges Stephen A.;Majcher Jared P. |
| 分类号 |
H02B1/56;H05K7/20;H01R4/48;H01R12/52;H01Q21/00;H02B1/20;H01L23/473 |
主分类号 |
H02B1/56 |
| 代理机构 |
|
代理人 |
Long Daniel J.;Asmus Scott J. |
| 主权项 |
1. An integrated heat exchanger and power delivery system for high powered electronic modules, comprising:
a coolant manifold; a heat exchanger and power delivery module, wherein the heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold; and a high powered electronic module, wherein the high powered electronic module comprises an array of sub-modules, wherein the array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements, and wherein the plurality of heat exchanger and power delivery elements are configured to simultaneously deliver power and extract heat away from the sub-modules. |
| 地址 |
Nashua NH US |
