发明名称 |
MEMS structures and methods for forming the same |
摘要 |
A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer. |
申请公布号 |
US9533876(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201514731823 |
申请日期 |
2015.06.05 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liu Ping-Yin;Huang Xin-Hua;Huang Hsin-Ting;Hsieh Yuan-Chih;Peng Jung-Huei;Chao Lan-Lin;Tsai Chia-Shiung;Cheng Chun-Wen |
分类号 |
H01L29/84;B81B7/00;H01L49/02;B81C1/00;H01G5/16;B81B3/00 |
主分类号 |
H01L29/84 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A device comprising:
a substrate; a micro-electro-mechanical system (MEMS) device over the substrate, wherein the MEMS device comprises:
a movable element as a first capacitor plate of a capacitor; anda fixed element as a second capacitor plate of the capacitor; a bond ring encircling the MEMS device, wherein the bond ring comprises a metal; and a protection layer over the bond ring, wherein the protection layer is capable of forming a eutectic metal with the bond ring. |
地址 |
Hsin-Chu TW |