発光半導体を相互接続するためのオーバーレイ回路構造

摘要

PROBLEM TO BE SOLVED: To mount LED chips on a curved surface IMS.SOLUTION: An LES device 10 includes: a heatsink 14; and an array of LES chips 12 mounted on the heatsink and electrically connected to the heatsink by way of a solder/silver epoxy layer 16. The LES device also includes a flexible interconnect structure 18 positioned on and electrically connected to each LES chip to provide controlled operation of the array of LES chips. The flexible interconnect structure further includes: a flexible dielectric film configured to conform to the shape of the heatsink; and a metal interconnect structure formed on the flexible dielectric film and that extends through vias formed in the flexible dielectric film so as to be electrically connected to the connection pads of the LES chips.