SUBSTRATE DISPOSITION APPARATUS INCLUDING COOLING DEVICE

摘要

An embodiment relates to a substrate processing apparatus which includes a cooling device having a structure capable of effectively cooling a substrate. According to an embodiment, the substrate processing apparatus comprises: a substrate placing unit which is provided on a lower inner side of the substrate processing apparatus; a first elevation unit which elevates the substrate placing unit; and a second elevation unit which is provided as a pipe formed with a hole, allows a cooling gas to be supplied to a lower side of a substrate placed on the substrate placing unit through the hole, and unloads the substrate from the substrate placing unit. The second elevation unit can comprise: an inlet pipe through which the cooling gas is introduced; and a branch pipe which branches from the inlet pipe, is provided in plurality, and has one end disposed on the lower side of the substrate to spray the cooling gas onto the lower side of the substrate.