BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

The present disclosure relates to bonding structures useful in semiconductor packages and methods of manufacturing the same. In an embodiment, the bonding structure comprises a substrate, having a top surface and including at least one bonding pad, wherein each bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface; and a semiconductor element including at least one pillar, wherein each pillar is bonded to a portion of the sloped surface of a corresponding bonding pad, and a gap is formed between a sidewall of the pillar and the sloped surface of the corresponding bonding pad.

主权项

1. A bonding structure, comprising:
a substrate, having a top surface and comprising at least one bonding pad, wherein the bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface; and a semiconductor element, comprising at least one pillar; wherein each pillar is bonded to a portion of the sloped surface of a corresponding one of the at least one bonding pad, and a gap is formed between a sidewall of the pillar and the sloped surface of the corresponding bonding pad; wherein the substrate further comprises a first insulation layer disposed on the top surface thereof and between the bonding pads, and the semiconductor element further comprises a second insulation layer between the pillars, wherein the first insulation layer contacts the second insulation layer.