发明名称 金属窒化膜、該金属窒化膜を用いた半導体装置、および半導体装置の製造方法
摘要 The present invention provides a metal nitride film that realizes an intended effective work function (for example, a high effective work function) and has EOT exhibiting no change or a reduced change, a semiconductor device using the metal nitride film, and a manufacturing method of the semiconductor device. The metal nitride film according to an embodiment of the present invention contains Ti, Al and N, wherein the metal nitride film has such molar fractions of Ti, Al and N as (N/(Ti+Al+N)) of 0.53 or more, (Ti/(Ti+Al+N)) of 0.32 or less, and (Al/(Ti+Al+N)) of 0.15 or less.
申请公布号 JP5937297(B2) 申请公布日期 2016.06.22
申请号 JP20100253647 申请日期 2010.11.12
申请人 キヤノンアネルバ株式会社 发明人 中川 隆史;北野 尚武
分类号 H01L21/336;C23C14/06;H01L21/28;H01L21/285;H01L21/8247;H01L27/105;H01L27/115;H01L29/423;H01L29/49;H01L29/78;H01L29/788;H01L29/792;H01L45/00;H01L49/00 主分类号 H01L21/336
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