| 摘要 |
A semiconductor device includes chips, wherein a first chip includes: an internal circuit (CKT1); first selectors (SELU1) to output signals from one of first outputs; second selectors to output signals from one of second outputs; first output buffer units (OBU1, OBU2, OBU3) to relay/interrupt signals output from one of the first outputs; second output buffer units to relay/interrupt signals output from one of the second outputs; first terminals (TM10a, TM12a, TM14a) to output a signal from the respective first output buffer units and belong to a first group in which the first terminals are placed at positions distant by first distances; and second terminals (TM13b, TM15b) to output a signal from the respective second output buffer units and belong to a second group in which the second terminals are placed at positions distant by second distances and each of the second terminals is placed at a position distant from an adjacent first terminal of the first terminals by third distances smaller than the first distances. |
