发明名称 A POINT COATING METHOD AND APPARATUS THE SAME
摘要 PURPOSE: A method and an apparatus for gold-plating points on a metal plate are provided to gold-plate the points at predetermined positions and to enable mass production by continuous gold-plating. CONSTITUTION: An apparatus for gold-plating points on a metal plate (15) comprises a supply roll, multiple guide rollers (R), a cylindrical tool (10), a motor (18), a pump (14), a control valve (12), and a winding roll. The supply roll winds the thin metal plate with a constant width. The guide rollers guide the metal plate supplied from the supply roll and are a cylindrical shaft so that the metal plate can be attached to the outer circumference thereof. The cylindrical tool comprises a spraying nozzle (11) for supplying a gold solution to the metal plate; and a receiving space for receiving a gold plating solution. The motor rotates the cylindrical tool at a speed corresponding to a supplying speed. The pump generates spraying pressure to discharge the gold plating solution to the spraying nozzle. The control valve controls the pressure of the pump. The winding roll winds the metal plate on which plating patterns are plated.
申请公布号 KR20130112238(A) 申请公布日期 2013.10.14
申请号 KR20120034468 申请日期 2012.04.03
申请人 YEON IL HI-P CO., LTD. 发明人 KIM, TAE KYU
分类号 C25D5/02;C25D3/48;C25D21/00 主分类号 C25D5/02
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