Integrated circuit packaging system with interposer structure and method of manufacture thereof

摘要

A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a carrier; forming a hole into the carrier; forming a pillar in the hole of the carrier; forming a conductive buildup over the pillar and on a carrier first side of the carrier; forming a molded body over the carrier and the pillar, the molded body for encapsulating the conductive buildup; and removing the carrier for exposing the pillar.