发明名称 Composition for metal plating comprising suppressing agent for void free submicron feature filling
摘要 A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a poly-hydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.
申请公布号 IL217234(A) 申请公布日期 2016.05.31
申请号 IL20110217234 申请日期 2011.12.27
申请人 BASF SE 发明人
分类号 C25D;H01L 主分类号 C25D
代理机构 代理人
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