COMPOSITION FOR SEALING LED, LED SEALING MATERIAL, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a composition for sealing an LED, which forms an LED sealing material improved in crack resistance, and to provide an LED sealing material improved in crack resistance and a semiconductor light-emitting device sealed with the LED sealing material.SOLUTION: The composition for sealing an LED contains: a polysilsesquioxane having a repeating unit represented by RSiO(where Rrepresents an alkyl group having two or more carbon atoms which may have a substituent); and a silicone oligomer having a repeating unit represented by SiOand having a weight-average molecular weight of 1,500 or less. The LED sealing material is obtained by heat-curing the composition for sealing an LED. The semiconductor light-emitting device includes a sealed part sealed with the LED sealing material.SELECTED DRAWING: None