Thermocompression bonding apparatus and method

摘要

A multi-layer aluminum nitride ceramic, multi-heating element substrate (11) is provided for forming electrical bonds between integrated circuits (13) and an interposer structure (14) using a thermocompression bonding process. The individually energizable heater element traces (9) can be run through common regions of the heater surface platform (5). A network of cooling vias can be run through other parts of the substrate. The traces are then separately controlled and energized during a predetermined routine resulting in a temperature profile that maintains a substantially constant temperature plateau phase near a reflow temperature, and a more uniform temperature across the spaced apart surface regions of the heater substrate, thus imparting a more precisely uniform heating to the parts being bonded.

主权项

1. A solid state electrical heater apparatus for heating the surface of a part, said apparatus comprises:
a part-contacting platform; said platform including a medial zone and a peripheral region laterally spaced a distance apart form said medial zone; a first heater element coursing along and being in thermal communication with said zone; a second heater element spaced apart from said first heater element; said second heater element coursing along and being in thermal communication with said region; and, wherein said first and second heater elements are separately energizable.