| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing condition setting method and a manufacturing method and a manufacturing system of a semiconductor ship, which can inhibit breakage of a semiconductor chip.SOLUTION: A semiconductor chip manufacturing condition setting method is a manufacturing condition setting method in a semiconductor chip manufacturing method including a process of forming a surface side groove on a surface of a substrate and a process of forming from a rear face of the substrate by a rotating cutting member having a thickness larger than a width of an entry of the surface side groove, a rear face side groove which opens onto the surface side groove to divide the substrate into semiconductor chips, and comprises: a process of checking a width of the surface side groove; and a process of setting a manufacturing condition which influences a range where the center of a tip of the cutting member in a thickness direction varies so as to be included in the checked width.SELECTED DRAWING: Figure 19 |
