| 摘要 |
A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package. |
| 主权项 |
1. A circuit package comprising:
a first semiconductor body with a first monolithic integrated circuit, the first monolithic circuit comprises a first signal output that is interconnected with a first bonding surface, and a first signal input that is interconnected with a second bonding surface; a second semiconductor body with a second monolithic integrated circuit, the second monolithic integrated circuit comprises a second signal output that is interconnected with a third bonding surface, and a second signal input that is interconnected with a fourth bonding surface; a contact element with at least one bonding surface; and a carrier element, wherein the first bonding surface of the first signal output and the fourth bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and wherein a portion of the contact element penetrates the circuit package. |
