发明名称 SEMICONDUCTOR APPARATUS AND METHOD OF REMOVING PHOTORESIST LAYER ON SUBSTRATE
摘要 A semiconductor apparatus for removing a photoresist layer on a substrate includes a platform, a first ultraviolet lamp, and an ozone supplier. The platform is used to support the substrate. The first ultraviolet lamp is used to provide first ultraviolet light. The ozone supplier has at least one first nozzle for introducing ozone toward the substrate through the first ultraviolet light, such that at least a part of the ozone is decomposed by the first ultraviolet light, and at least a part of the decomposed ozone reaches the photoresist layer to react with the photoresist layer. Moreover, a method of removing a photoresist layer on a substrate is also provided.
申请公布号 US2016129484(A1) 申请公布日期 2016.05.12
申请号 US201414535163 申请日期 2014.11.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHANG Jui-Chuan;KU Shao-Yen;TSAI Wen-Chang;YU Shang-Yuan;HSIAO Chien-Wen;HSU Fan-Yi
分类号 B08B7/00;H01L21/02 主分类号 B08B7/00
代理机构 代理人
主权项 1. A semiconductor apparatus for removing a photoresist layer on a substrate, comprising: a platform for supporting the substrate; a first ultraviolet lamp for providing first ultraviolet light; an ozone supplier having at least one first nozzle for introducing ozone toward the substrate through the first ultraviolet light, such that at least a part of the ozone is decomposed by the first ultraviolet light, and at least a part of the decomposed ozone reaches the photoresist layer to react with the photoresist layer.
地址 Hsinchu TW