| 摘要 |
PROBLEM TO BE SOLVED: To allow for cost reduction by eliminating the machining or bonding, while reducing the weight.SOLUTION: A semiconductor cooling structure includes a substrate case 3 to which a substrate 2 mounting a semiconductor 1 is fixed, and a cooler 5 installed below the substrate case 3. The cooler 5 includes a tubular body 11 of uniform cross-section formed by extrusion molding, and resin refrigerant liquid supply and discharge sections 12 provided at both ends 15 of the tubular body 11. The refrigerant liquid supply and discharge section 12 has a tube insertion holding section 16 capable of inserting and holding the end 15 of the tubular body 11 via an elastic seal ring 14. The refrigerant liquid supply and discharge section 12 and substrate case 3 are fastened and fixed in place by a fastening and fixing member 17.SELECTED DRAWING: Figure 3 |
