发明名称 NON-PLANAR SEMICONDUCTOR DEVICE WITH ASPECT RATIO TRAPPING
摘要 As disclosed herein, a semiconductor device with aspect ratio trapping is provided, including a bulk substrate, a plurality of isolation pillars formed on the bulk substrate, wherein one or more gaps are formed between the isolation pillars, an oxide layer formed by epitaxy on the bulk substrate, between the isolation pillars, wherein the oxide layer partially fills the gaps between the isolation pillars, one or more fins formed over the oxide layer between the isolation pillars, such that the one or more fins fill the gaps between the isolation pillars, wherein the oxide layer electrically isolates the one or more fins from the bulk substrate. The oxide layer has an aspect ratio that is selected to substantially eliminate defects at the interface between the oxide layer and the fins. The semiconductor device may also include a semiconductor layer between the bulk substrate and oxide layer.
申请公布号 US2016126086(A1) 申请公布日期 2016.05.05
申请号 US201414533360 申请日期 2014.11.05
申请人 International Business Machines Corporation 发明人 Cheng Kangguo;Hashemi Pouya;Khakifirooz Ali;Reznicek Alexander
分类号 H01L21/02;H01L27/088;H01L21/84;H01L29/06 主分类号 H01L21/02
代理机构 代理人
主权项 1. A non-planar semiconductor device with aspect ratio trapping comprising: a bulk substrate; a plurality of isolation pillars formed on the bulk substrate, wherein one or more gaps are formed between the isolation pillars; an oxide layer, comprised of a La1-xYxOy material, formed by epitaxy on the bulk substrate, between the isolation pillars, wherein the oxide layer partially fills the gaps between the isolation pillars, and wherein the oxide layer comprises a gradient of defects, and wherein the gradient of defects is concentrated at an interface of the bulk substrate and the oxide layer; one or more fins formed over the oxide layer between the isolation pillars, such that the one or more fins fill the gaps between the isolation pillars, wherein the oxide layer electrically isolates the one or more fins from the bulk substrate; and wherein the oxide layer has an aspect ratio that is selected to substantially eliminate defects at the interface between the oxide layer and the fins.
地址 Armonk NY US