SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module which prevents a collector plate and an emitter plate from being electrically connected.SOLUTION: A semiconductor module comprises: a cooler 20; collector wiring 30 provided on an insulation layer 22 of the cooler 20; emitter wiring 40 provided on the insulation layer 22; a first conductive junction part 51 which is provided on the collector wiring 30 and has conductivity; a second conductive junction part 52 which is provided on the emitter wiring 40 and has conductivity; a semiconductor device 60; and an insulation part which is provided between the first conductive junction part 51 and the second conductive junction part 52 and has insulation properties for insulating the first conductive junction part 51 and the second conductive junction part 52. A collector plate 63 of the semiconductor device 60 is electrically connected to the first conductive junction part 51. An emitter plate 65 of the semiconductor device is electrically connected to the second conductive junction part 52.SELECTED DRAWING: Figure 2