SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition which can suppress the warpage of a semiconductor device.SOLUTION: A sealing resin composition comprises epoxy resin (A), an inorganic filler (B), and a curing agent (C). The curing agent (C) comprises phenolic resin (C1) having a structure derived from phenol and/or naphthol having a C1-C5 alkyl group and/or alkenyl as a substituent, where a number average molecular weight (Mn) of the phenolic resin (C1) measured by gel permeation chromatography (GPC) is 500 to 2000 or less.SELECTED DRAWING: None