Method and Apparatus for Connecting Packages onto Printed Circuit Boards

摘要

Methods and apparatus are disclosed for attaching the integrated circuit (IC) packages to printed circuit boards (PCBs) to form smooth solder joints. A polymer flux may be provided in the process to mount an IC package to a PCB. The polymer flux may be provided on connectors of the IC package, or provided on PCB contact pad and/or pre-solder of the PCB. When the IC package is mounted onto the PCB, the polymer flux may cover a part of the connector, and may extend to cover a surface of the molding compound on the IC package. The polymer flux may completely cover the connector as well. The polymer flux delivers a fluxing component that facilitates smooth solder joint formation as well as a polymer component that offers added device protection by encapsulating individual connectors. The polymer component may be an epoxy.

主权项

1. A method of forming a device, comprising:
providing an integrated circuit (IC) package comprising a connector and an IC, and a molding compound, the molding compound encapsulating a portion of the connector, wherein a portion of the connector protrudes above a topmost surface of the molding compound; providing a printed circuit board (PCB) comprising a PCB contact pad; selectively applying a polymer flux to the portion of the PCB contact pad; and after selectively applying the polymer flux, bringing the IC package into contact with the PCB and forming a connection between the PCB contact pad and the connector, wherein the polymer flux covers at least a part of the connector and extends over the topmost surface of the molding compound after the IC package and the PCB are brought into contact.