发明名称 Semiconductor device including conductive layer with conductive plug
摘要 Some embodiments include a semiconductor device which includes a first conductive layer formed on the semiconductor substrate and a first contact plug connected to the first conductive layer. The first conductive layer includes a plurality of loops of conductive material over the semiconductor substrate. Each of the plurality of loops comprises a first opening and a second opening, a first portion and a second portion sandwiching the first opening, a third portion and a fourth portion sandwiching the second opening, a first tab portion connected to the first portion and the third portion and having a first length in a first direction and a first width in a second direction perpendicular to the first direction, and a second tab portion connected to the second portion and the fourth portion and having a second length in the first direction and a second width in the second direction.
申请公布号 US9318416(B2) 申请公布日期 2016.04.19
申请号 US201514601960 申请日期 2015.01.21
申请人 Micron Technology, Inc. 发明人 Aya Tsutomu
分类号 H01L23/52;H01L23/48;H01L27/108 主分类号 H01L23/52
代理机构 Wells St. John P.S. 代理人 Wells St. John P.S.
主权项 1. A semiconductor device comprising a first conductive line, the first conductive line comprising: a first portion extending in a first direction and including first and second end parts; a second portion extending in a second direction from the second end part of the first portion, the second direction being substantially perpendicular to the first direction, the second portion including third and fourth end parts, the third end part of the second portion merging with the second end part of the first portion; a third portion extending in the first direction from the fourth end part of the second portion toward the first end part of the first portion, the third portion including fifth and sixth end parts, the fifth end part of the third portion merging with the fourth end part of the second portion; a fourth portion extending in the first direction from the second portion on an opposite side to the first end part of the first portion; and wherein the second portion includes an intermediate part between the third and fourth end parts, and the fourth portion being in contact with the intermediate part of the second portion.
地址 Boise ID US